Dr. Jinhong Yu
Department of Polymer Science and Engineering and
Shanghai Key Lab of Electrical Insulation and Thermal Aging
Shanghai Jiao Tong University
Shanghai, China
Friday, December 7, 2012
3:00 – 4:00 pm Research Seminar 205 G Hall
Abstract: Ever increasing demand for higher density circuits in electronics has greatly accelerated the miniaturization and integration of chip electronic components with high performance and multi-function, smaller size, high efficiency and low cost. The improvement in size and performance should result in the generation of a greater amount of heat in a smaller volume of space. To ensure proper device operation, the unwanted heat must be removed. Thermal conductive polymer composites offer new possibilities to solve this problem due to the polymer advantages such as light weight and ease of processing. In this talk, our interest to improve the thermal conductivity of polymer is focused on the selective addition of high thermal conductive fillers, such as alumina (Al2O3), graphene sheets (GSs) and boron nitride (BN) nanoplatelets.
Keywords: Thermal conductivity; Dielectric; Epoxy; Poly(vinylidene fluride); Alumina; Graphene; Boron nitride; Composites
